OEM Supply Glass Cover Replacement For Iphone 6g - Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding – Jiutu

Short Description:

Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in ju...

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OEM Supply Glass Cover Replacement For Iphone 6g - Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding – Jiutu Detail:

Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

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We're also concentrating on improving the things administration and QC program to ensure we could maintain terrific gain from the fiercely-competitive company for OEM Supply Glass Cover Replacement For Iphone 6g - Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding – Jiutu, The product will supply to all over the world, such as: Panama , Istanbul , South Africa , Our company sets up several departments, including production department, sales department, quality control department and sevice center,etc. only for accomplish the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment. We always think about the question on the side of the customers,because you win,we win!

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