OEM China Vacuum Separator - Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu

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Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu Function : The length of the cutter head of the product can be customized within 90mm*width of 5mm; the temperature can be set at 0-450 degrees, and the pressure can be adjusted from 0-0.6mpa. The platform has a pre-heating function, and the camera can be positioned up or down according to the requirements, and the lens multiples can be configured according to the samples provided by the customer. Main Features : The constant...


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OEM China Vacuum Separator - Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu Detail:

Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu

Function :

The length of the cutter head of the product can be customized within 90mm*width of 5mm; the temperature can be set at 0-450 degrees, and the pressure can be adjusted from 0-0.6mpa. The platform has a pre-heating function, and the camera can be positioned up or down according to the requirements, and the lens multiples can be configured according to the samples provided by the customer.
Main Features :
The constant temperature heating method is adopted, and the main structure is made of 45# steel with high precision and good stability. Using Japanese SMC cylinder + precision pressure regulating valve to precisely control the pressing force. Imported thermal insulation module and special tungsten steel cutter head are used for durability and high temperature accuracy. HD auxiliary alignment system.
Working principle :The ACF glue process is mainly used to bind the chip, FPC or FFC cable together according to the pressure, temperature and time parameters of the ACF glue. According to the equivalent force and temperature output by the hot press, the ACF particles are hot-pressed and blasted at a certain time, so as to achieve the purpose of vertical conduction and horizontal non-conduction.
Working area :
1,Mobile phone cable binding field,
2,medical field,
3,laboratory research and development test

 

Model
FPC/FFC bonding machine
P/N
9TU-M039A
Heating Method
Pulse heating
Working Tempature
0℃ to 500℃
Working Humidity
40%–95%RH
Working Rated Power
2500W
Machine Size
64*55*57CM
Net Weight
85kg
Working Pressure
4–6kgf/cm2
Working Pressure
0.4-0.8Mpa
Volatge,Power Supply
220V 50Hz

 

 


Product detail pictures:

OEM China Vacuum Separator -
 Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu detail pictures

OEM China Vacuum Separator -
 Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu detail pictures

OEM China Vacuum Separator -
 Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu detail pictures

OEM China Vacuum Separator -
 Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu detail pictures

OEM China Vacuum Separator -
 Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu detail pictures


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Our items are commonly identified and trusted by customers and may fulfill continuously switching economic and social wants of OEM China Vacuum Separator - Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu, The product will supply to all over the world, such as: Maldives , Sri Lanka , Salt Lake City , With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.
  • We have been looking for a professional and responsible supplier, and now we find it.
    5 Stars By Sally from Jamaica - 2017.05.02 11:33
    This company conforms to the market requirement and joins in the market competition by its high quality product, this is an enterprise that have Chinese spirit.
    5 Stars By Evangeline from Gabon - 2017.02.14 13:19

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