Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu

Short Description:

Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu Function : The length of the cutter head of the product can be customized within 90mm*width of 5mm; the temperature can be set at 0-450 degrees, and the pressure can be adjusted from 0-0.6mpa. The platform has a pre-heating function, and the camera can be positioned up or down according to the requirements, and the lens multiples can be configured according to the samples provided by the customer. Main Features : The constant...


  • FOB Price: US $0.5 - 9,999 / Piece
  • Min.Order Quantity: 100 Piece/Pieces
  • Supply Ability: 10000 Piece/Pieces per Month
  • Product Detail

    Product Tags

    Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu

    Function :

    The length of the cutter head of the product can be customized within 90mm*width of 5mm; the temperature can be set at 0-450 degrees, and the pressure can be adjusted from 0-0.6mpa. The platform has a pre-heating function, and the camera can be positioned up or down according to the requirements, and the lens multiples can be configured according to the samples provided by the customer.
    Main Features :
    The constant temperature heating method is adopted, and the main structure is made of 45# steel with high precision and good stability. Using Japanese SMC cylinder + precision pressure regulating valve to precisely control the pressing force. Imported thermal insulation module and special tungsten steel cutter head are used for durability and high temperature accuracy. HD auxiliary alignment system.
    Working principle :The ACF glue process is mainly used to bind the chip, FPC or FFC cable together according to the pressure, temperature and time parameters of the ACF glue. According to the equivalent force and temperature output by the hot press, the ACF particles are hot-pressed and blasted at a certain time, so as to achieve the purpose of vertical conduction and horizontal non-conduction.
    Working area :
    1,Mobile phone cable binding field,
    2,medical field,
    3,laboratory research and development test

     

    Model
    FPC/FFC bonding machine
    P/N
    9TU-M039A
    Heating Method
    Pulse heating
    Working Tempature
    0℃ to 500℃
    Working Humidity
    40%–95%RH
    Working Rated Power
    2500W
    Machine Size
    64*55*57CM
    Net Weight
    85kg
    Working Pressure
    4–6kgf/cm2
    Working Pressure
    0.4-0.8Mpa
    Volatge,Power Supply
    220V 50Hz

     

     


  • Previous:
  • Next:

  • Related Products

    WhatsApp Online Chat !